Researchers at IBM's Zurich labs say they've come up with a new technique to make semiconductors run cooler.
The innovation involves the glue used to hold microprocessor components together. Most current glues are enriched with microscopic particles of metal or ceramic that would theoretically aid in heat dissipation, but cooling results have been disappointing.
IBM's lab folk discovered it's a matter of how the glue is applied. Etch tiny channels into the base of the chip, and the heat-eating molecules will spread evenly enough to work, instead of clumping up in useless piles.
IBM finds way to keep chips cooler[InfoWorld]
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